*ST丹邦（购买于2021年6月）*ST丹邦，公司名称：深圳丹邦科技股份有限公司。2001年成立。2011年9月在深圳证券交易所上市。股票代码：002618。
是一家专业从事挠性电路与材料的研发和生产的国家高新技术企业。截止目前为止共计拥有"用于芯片封装的柔性基板及其制作方法"、"多叠层多芯片封装在柔性电路基板上的方法及封装芯片"等37项授权发明专利。是全球极少数产业链涵盖从基材、基板到芯片封装的企业之一。
此股票前期十多天的连跌模式，陪它的只有时间和观望。
时来天地皆同力：
今日半导体的风继续吹，陪它的除有时间和观望外，还有钱。 *ST Danbang, company name: Shenzhen Danbang Technology Co., Ltd.. Established in 2001. It was listed on Shenzhen Stock Exchange in September 2011. Stock code: 002618.
It is a national high-tech enterprise specializing in R&D and production of flexible circuits and materials. Up to now, it has 37 authorized invention patents, such as "Flexible substrate for chip packaging and its manufacturing method", "Method for packaging multi-stack multi-chip on flexible circuit substrate and packaging chip". It is one of the few enterprises in the world whose industrial chain covers substrate, substrate and chip packaging.
This stock has been losing streak for more than ten days in the early stage, and only time and wait-and-see will accompany it.
When times come, heaven and earth are all the same;
Today, the wind of semiconductor continues to blow, accompanied by money besides time and wait-and-see.
